Introduction to SMT-B Line for Surface Mount Printed Circuit Boards: Compatible with L Size
Implementation of L-size substrates is possible!! Here is a list of equipment specifications and facilities for the surface mount technology (SMT-B line) process of printed circuit boards.
We handle everything from small lot multi-variety printed circuit board assembly for L-size substrates to the assembly and packaging of finished products, and we have established a system that allows us to provide products consistently, primarily through production outsourcing. ◆ Line Name: Surface Mount: SMT-B Line ◆ Target Substrate Dimensions: 50(W)×50(L) to 390–460mm ◆ Target Component Dimensions: 0402 to 120×90mm, minimum 0.4mm pitch ◆ Target Component Height: up to 28mm ◆ Target Component Variety: 280 varieties (equivalent to 8mm tape) 【Equipment】 Printer: SPG2 (Panasonic) with 2D solder inspection + coating function Mounting Machine: AM100 (Panasonic) Mounting Machine: AM100 (Panasonic) with tray changer N2 Compatible Reflow Oven: TNV-N568CR-P (Tamura Manufacturing) *For details, please download and view the materials.
- Company：浜松パルス 都田工場
- Price：Other
